Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy

Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile.

Advantages & Application Notes:•

• This product is the two component version of EPO-TEK® E3001. The two component version can offer advantages such as: lower cost, room temperature shipment instead of pre-mixed and frozen dry ice shipments, and maximum pot-life observed at site.
• Versatility & Cure: snap cures of 90 seconds, fast cures of 15 minutes and traditional oven cures of 1-3 hours can be realized.
• Designed for JEDEC Level III and II packaging criteria.
• Compatible with die sizes up to 250 mil x 250 mil. Also recommended for small die such as LEDs and GaAs devices like 10 mil x 10 mil.
• Beneficial radius of curvature after die-attach cure.
• Compatible with high volume, automated syringe dispensing manufacturing processes.
• Suggested applications:
  • Semiconductor: die attach onto lead-frames such as Ag spot die paddle, COB, advanced packages, and hybrid circuits.
  • Hybrid Microelectronics: die attach bonding onto ceramic PCB, as well as attaching SMDs onto the same substrate.
  • Opto-electronics:
    • Die attach of LEDs, LED arrays, LED on PCB, or packaged onto lead-frames.
    • Die attach epoxy for near-IR chips used in IRDA (Infra Red Data Acquisition).
    • Die-attach bonding of laser diode or photo-diode for fiber optics packaging.
• Many modifications are available, including lower temperature cure, lower stress, longer pot-life, and higher thixotropic index.

Information Provided by Epoxy Technology

物理性能	额定值 (公制)	额定值 (英制)	测试方法
比重	g/cc	g/cc	Part B
	g/cc	g/cc	Part A
粘度	cP @Temperature 23.0 °C	cP @Temperature 73.4 °F	100 rpm

化学性能	额定值 (公制)	额定值 (英制)	测试方法
Ionic Impurities - Cl (Chloride)	ppm	ppm

机械性能	额定值 (公制)	额定值 (英制)	测试方法
肖氏硬度 (邵氏 D)
拉伸模量	GPa	ksi	Storage
剪切强度	MPa	psi	Lap
	>= MPa	>= psi	Die

电气性能	额定值 (公制)	额定值 (英制)	测试方法
体积电阻率	>= ohm-cm	>= ohm-cm
	>= ohm-cm	>= ohm-cm	200°C/2 min

热性能	额定值 (公制)	额定值 (英制)	测试方法
线性热膨胀系数	µm/m-°C	µin/in-°F	Below Tg
	µm/m-°C	µin/in-°F	Above Tg
导热系数	W/m-K	BTU-in/hr-ft²-°F
最高工作温度, Air	°C	°F	Continuous
	°C	°F	Intermittent
最低工作温度, Air	°C	°F	Continuous
	°C	°F	Intermittent
玻璃化转变温度，Tg	>= °C	>= °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
分解温度	°C	°F	Degradation Temperature; TGA

加工性能	额定值 (公制)	额定值 (英制)	测试方法
固化时间	min @Temperature 170 °C	hour @Temperature 338 °F	Bond Line
	min @Temperature 160 °C	hour @Temperature 320 °F	Bond Line
	min @Temperature 150 °C	hour @Temperature 302 °F	Bond Line
适用期	min	min
保质期	Month @Temperature 25.0 °C	Month @Temperature 77.0 °F

材料描述		测试方法
颜色	Amber	Part B
	Silver	Part A
Consistency	Smooth Thixotropic Paste
Mix Ratio By Weight	100:3
Number of Components	Two
Weight Loss	0.04%	200°C
	0.22%	300°C