Tra-Con Tra-Bond 77-1S One Component SMD Adhesive

TRA-BOND 77-1S one component, solvent-free, insulating epoxy adhesive is designed specifically for attaching surface mounted devices (SMDs) to printed circuit boards prior to wave solder. TRA-BOND 77-1S adhesive exhibits outstanding moisture resistance, eliminating concern about significant electrical leakage after long-term exposure to high humidity conditions. This adhesive withstands 1000 hours at 100°C and 95% relative humidity testing with only a slight drop in insulation resistance. In addition, TRA-BOND 77-1S adhesive exhibits superior application features. Its soft, smooth consistency permits application through fine diameter needles. This adhesive exhibits no tailing or sagging. Small uniform dots may be dispensed for capacitor and resistor attach. To satisfy the seated heights of SOT devices, narrow peaks or multiple dots may be used. TRA-BOND 77-1S adhesive is also ideally suited for application by screening or pin transfer.

Information provided by Tra-Con Inc.

物理性能	额定值 (公制)	额定值 (英制)	测试方法
粘度	cP	cP	Mixed

机械性能	额定值 (公制)	额定值 (英制)	测试方法
肖氏硬度 (邵氏 D)
粘合强度	MPa	psi	Lap shear, alum to alum

电气性能	额定值 (公制)	额定值 (英制)	测试方法
体积电阻率	ohm-cm	ohm-cm
介电常数	@Frequency 1000 Hz	@Frequency 1000 Hz
耗散因数	@Frequency 1000 Hz	@Frequency 1000 Hz

热性能	额定值 (公制)	额定值 (英制)	测试方法
线性热膨胀系数	µm/m-°C	µin/in-°F	Below Tg
	µm/m-°C	µin/in-°F	Above Tg
导热系数	W/m-K @Temperature 121 °C	BTU-in/hr-ft²-°F @Temperature 250 °F
玻璃化转变温度，Tg	°C	°F	Ultimate Tg

加工性能	额定值 (公制)	额定值 (英制)	测试方法
固化时间	min @Temperature 200 °C	hour @Temperature 392 °F
	min @Temperature 175 °C	hour @Temperature 347 °F
	min @Temperature 150 °C	hour @Temperature 302 °F
保质期	Month	Month	At 5°C
	Month @Temperature -40.0 °C	Month @Temperature -40.0 °F

材料描述		测试方法
Device Shear grams	2000	Thick Film Resistors
Weight Loss %	0.33	At 250°C
Working Life months	3	At 25°C