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FM® 680-1

PI,TS

Cytec Industries Inc.

产品说明

FM® 680-1 polyimide adhesive is a non-metallic version of FM 680 film adhesive designed for continuous service at temperature up to 700°F (371°C). FM 680-1 adhesive was specifically developed for radar transparent applications requiring extreme environmental durability. FM 680-1 adhesive is capable of bonding composite laminates and a wide variety of high temperature metallic substrates such as stainless steel and titanium while maintaining thermal oxidative stability. FM 680-1 adhesive is an excellent candidate for aircraft engine applications or for the bonding of new composite materials requiring co-cure or consolidation temperature up to 735°F (391°C). This adhesive is processible under standard manufacturing operations at temperatures as low as 600°F (316°C) and can handle freestanding post-cure up to 735°F (391°C). To achieve maximum performance in bonding prepared metallic details the use of BR® 680 primer is recommended. FM 680-1 adhesive is a non-aluminum-filled, condensation polyimide supported on fiberglass cloth. It is available in film, foam and paste forms. FM 680-1 adhesive utilizes the NR-150 B2 chemistry developed by DuPont.

Suggested Applications:
Titanium bonding
Stainless steel bonding
Polyimide composite bonding
基本信息
特性
  • 良好粘结性
  • 耐热性,高
  • 热稳定性,良好
用途
  • 航空航天应用
  • 泡沫
  • 粘合
  • 粘合剂
外观
  • 褐色
形式
  • 薄膜
  • 粘贴剂
机械性能额定值单位制
剪切强度 1
    24°C MPa
    177°C MPa
备注
1 .FM 680-1 film adhesive, 0.10 psf (490 gsm), 6AI-4V Titanium 0.05 in. (1.27 mm), Post-cure 16 hours at 600°F (316°C)
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